Send Inquiry
Send InquiryEUBO Modified Epoxy Underfill for CSP/BGA Packaging UV & Thermal Curing for E-paper, ESL, and Smart Card Applications
Price 16 USD ($)/ Piece
EUBO Modified Epoxy Underfill for CSP/BGA Packaging UV & Thermal Curing for E-paper, ESL, and Smart Card Applications Specification
- Storage Temperature
- 25 Celsius (oC)
- Hardness
- 70D
- Shelf Life
- 6 Months
- Features
- High Quality
- Adhesive Type
- Other
- Application
- electronic paper (E-paper), electronic shelf labels (ESL), and smart cards
- Color
- black
- Physical State
- Liquid
EUBO Modified Epoxy Underfill for CSP/BGA Packaging UV & Thermal Curing for E-paper, ESL, and Smart Card Applications Trade Information
- Minimum Order Quantity
- 100 Pieces
- Supply Ability
- 11000 Pieces Per Year
- Delivery Time
- 5 Week
- Sample Policy
- Contact us for information regarding our sample policy
- Packaging Details
- Pack Type: Carton Net Weight: 20 pieces or 30 pieces per carton Sealed and labeled with product information and batch number Suitable for safe transportation and storage
- Certifications
- QC80000 Certified SA8000:2014 Certified NSF Food Grade Certification ISO 14001 Certified ISO 45001 Certified IATF 16949 Certified
About EUBO Modified Epoxy Underfill for CSP/BGA Packaging UV & Thermal Curing for E-paper, ESL, and Smart Card Applications
EUBO Modified Epoxy Underfill UV5110 is an epoxy underfill material designed for CSP and BGA packages. It features dual curing via UV and thermal processes, offering excellent adhesion, mechanical reinforcement, and protection against thermal stress. Ideal for enhancing reliability in delicate electronics such as electronic paper (E-paper), electronic shelf labels (ESL), and smart cards.
Key Features:
-
-
-
Dual curing: UV and thermal
-
Strong adhesion to CSP/BGA packages
-
Excellent mechanical support and reliability
-
Suitable for delicate and thin electronics
-
-
Typical Applications:
-
-
Electronic paper (E-paper)
-
Electronic shelf labels (ESL)
-
Smart card technologies
-
Price:
- 50
- 100
- 200
- 250
- 500
- 1000+
More Products in Electronic Adhesive Category
EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly
Price 16 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Storage Temperature : 25 Celsius (oC)
Shelf Life : 6 Months
Features : High Quality
Adhesive Type : Hot Melt
EUBO Moisture-Curing Black PUR Hot Melt Adhesive for Edge Sealing of Smart Wearable Electronic Display Screens
Price 16 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Storage Temperature : 25 Celsius (oC)
Shelf Life : 6 Months
Features : High Quality
Adhesive Type : Hot Melt
EUBO Room Temperature Curing Silicone AdhesiveTwo-Component Sealant for Semiconductor Devices and Electronic Components
Price 16 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Storage Temperature : 25 Celsius (oC)
Shelf Life : 6 Months
Features : High Quality
Adhesive Type : Other
Single-Component UV Epoxy Adhesive,Fast-Curing,High-Strength Glue for Metal,Glass,Wood,Plastic and More,UV Curing Epoxy Adhesive
Price 13 USD ($) / Kilograms
Minimum Order Quantity : 100 Kilograms
Storage Temperature : 25 Celsius (oC)
Shelf Life : 6 Months
Features : High Quality
Adhesive Type : Pressure Sensitive
Send InquiryOur Products
Send Inquiry
Developed and Managed by Infocom Network Private Limited.
