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Send InquiryEUBO Modified Epoxy Underfill for CSP/BGA Packaging UV & Thermal Curing for E-paper, ESL, and Smart Card Applications
Price 16 USD ($)/ Piece
EUBO Modified Epoxy Underfill for CSP/BGA Packaging UV & Thermal Curing for E-paper, ESL, and Smart Card Applications Specification
- Adhesive Type
- Other
- Shelf Life
- 6 Months
- Hardness
- 70D
- Features
- High Quality
- Storage Temperature
- 25 Celsius (oC)
- Application
- electronic paper (E-paper), electronic shelf labels (ESL), and smart cards
- Color
- black
- Physical State
- Liquid
EUBO Modified Epoxy Underfill for CSP/BGA Packaging UV & Thermal Curing for E-paper, ESL, and Smart Card Applications Trade Information
- Minimum Order Quantity
- 100 Pieces
- Supply Ability
- 11000 Pieces Per Year
- Delivery Time
- 5 Week
- Sample Policy
- Contact us for information regarding our sample policy
- Packaging Details
- Pack Type: Carton Net Weight: 20 pieces or 30 pieces per carton Sealed and labeled with product information and batch number Suitable for safe transportation and storage
- Certifications
- QC80000 Certified SA8000:2014 Certified NSF Food Grade Certification ISO 14001 Certified ISO 45001 Certified IATF 16949 Certified
About EUBO Modified Epoxy Underfill for CSP/BGA Packaging UV & Thermal Curing for E-paper, ESL, and Smart Card Applications
EUBO Modified Epoxy Underfill UV5110 is an epoxy underfill material designed for CSP and BGA packages. It features dual curing via UV and thermal processes, offering excellent adhesion, mechanical reinforcement, and protection against thermal stress. Ideal for enhancing reliability in delicate electronics such as electronic paper (E-paper), electronic shelf labels (ESL), and smart cards.
Key Features:
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Dual curing: UV and thermal
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Strong adhesion to CSP/BGA packages
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Excellent mechanical support and reliability
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Suitable for delicate and thin electronics
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Typical Applications:
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Electronic paper (E-paper)
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Electronic shelf labels (ESL)
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Smart card technologies
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Price:
- 50
- 100
- 200
- 250
- 500
- 1000+
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