EUBO Modified Epoxy Underfill UV5110 is an epoxy underfill material designed for CSP and BGA packages. It features dual curing via UV and thermal processes, offering excellent adhesion, mechanical reinforcement, and protection against thermal stress. Ideal for enhancing reliability in delicate electronics such as electronic paper (E-paper), electronic shelf labels (ESL), and smart cards.
Key Features:
Dual curing: UV and thermal
Strong adhesion to CSP/BGA packages
Excellent mechanical support and reliability
Suitable for delicate and thin electronics
Typical Applications:
Electronic paper (E-paper)
Electronic shelf labels (ESL)
Smart card technologies
Price:
Price 15 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Shelf Life : 3 Months
Features : High Quality
Physical State : Liquid
Storage Temperature : 40 Celsius (oC)
Price 15 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Shelf Life : 6 Months
Features : High Quality
Physical State : Liquid
Storage Temperature : 25 Celsius (oC)
Price 16 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Shelf Life : 6 Months
Features : High Quality
Physical State : Liquid
Storage Temperature : 25 Celsius (oC)
Price 16 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Shelf Life : 6 Months
Features : High Quality
Physical State : Liquid
Storage Temperature : 25 Celsius (oC)