Send Inquiry
Send InquiryYW-613E Toughened Epoxy Adhesive-Controlled Curing for Electronic Components & Structural Bonding
Price 1 USD ($)/ Gram
YW-613E Toughened Epoxy Adhesive-Controlled Curing for Electronic Components & Structural Bonding Specification
- Adhesive Type
- Other
- Features
- Good Quality
- Form
- Liquid
- Purity
- 99%
- Application
- Electronic-Grade Epoxy Crosslinker
- Color
- Orange-Red
YW-613E Toughened Epoxy Adhesive-Controlled Curing for Electronic Components & Structural Bonding Trade Information
- Minimum Order Quantity
- 2000 Grams
- Payment Terms
- Cash in Advance (CID), Telegraphic Transfer (T/T)
- Supply Ability
- 10000 Grams Per Year
- Delivery Time
- 4 Week
- Sample Policy
- Contact us for information regarding our sample policy
- Packaging Details
- Pack Type: Cylindrical Can Net Weight: 1 kg per can, 6 kg per carton (6 cans per box) Sealed and labeled with product information and batch number Suitable for safe transportation and storage
- Main Export Market(s)
- Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa
- Certifications
- QC80000 Certified SA8000:2014 Certified NSF Food Grade Certification ISO 14001 Certified ISO 45001 Certified IATF 16949 Certified
About YW-613E Toughened Epoxy Adhesive-Controlled Curing for Electronic Components & Structural Bonding
YW-613E Provides high-performance, toughened bonding for electronic components and structural applications. Designed for medium-to-high reactivity, it allows controlled curing while maintaining excellent toughness and flexibility, making it ideal for applications requiring stress resistance, heat endurance, and impact protection.
Key Features:
-
Medium-to-high reactivity for controlled curing
-
Toughened formulation for high mechanical strength and impact resistance
-
Maintains flexibility and heat resistance for demanding electronic applications
-
Excellent adhesion to metals, plastics, and electronic substrates
-
Suitable for applications requiring precise control over curing speed and toughness
Typical Applications:
-
Electronic adhesives and component bonding
-
Structural adhesives for electronics
-
Protection of electronic components
-
Applications where curing control and toughness are critical
Price:
- 50
- 100
- 200
- 250
- 500
- 1000+
More Products in Electronic Adhesive Category
YW-603E High-Functionality Epoxy Resin-High Crosslink Density & Thermal Stability for IC & Semiconductor Encapsulation
Price 1 USD ($) / Gram
Minimum Order Quantity : 2000 Grams
Storage Temperature : 525C Celsius (oC)
Features : High Crosslink Density, Excellent Thermal Stability, Superior Dielectric Properties, Moisture Resistant, Good Moldability
Shelf Life : 12 Months
Color : Pale Yellow
EUBO High-Strength Epoxy Adhesive for Glass-to-Glass Bonding Transparent, Durable and Impact-Resistant Structural Adhesive
Price 14 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Storage Temperature : 40 Celsius (oC)
Features : High Quality
Shelf Life : 3 Months
Color : Offwhite
EUBO Custom Adhesive for Smartphone Screen Bonding Ideal for Display and Touch Module Integration Adhesive
Price 18 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Storage Temperature : 25 Celsius (oC)
Features : High Quality
Shelf Life : 6 Months
Color : black
Fast Curing Two-Component Epoxy Adhesive for Metal, Wood, Ceramic, Glass ,Room Temperature Bonding Epoxy Adhesive EP 8211
Price 16 USD ($) / Kilograms
Minimum Order Quantity : 100 Kilograms
Storage Temperature : 25 Celsius (oC)
Features : High Quality
Shelf Life : 6 Months
Send InquiryOur Products
Send Inquiry
Developed and Managed by Infocom Network Private Limited.
