EUBO Solvent-Free Two-Component Structural Adhesive for Power Battery Bonding, Chip Bonding, and Automotive Assembly

Price 16 USD ($)/ Piece

Get a Price/Quote

MOQ : 100 Pieces

EUBO Solvent-Free Two-Component Structural Adhesive for Power Battery Bonding, Chip Bonding, and Automotive Assembly Specification

Adhesive Type
Other

Features
High Quality

Storage Temperature
25 Celsius (oC)

Hardness
80D

Shelf Life
6 Months

Application
power battery bonding, chip bonding, and automotive structural assembly

Color
Light Yellow

Physical State
Liquid

EUBO Solvent-Free Two-Component Structural Adhesive for Power Battery Bonding, Chip Bonding, and Automotive Assembly Trade Information

Minimum Order Quantity
100 Pieces

Payment Terms
Cash in Advance (CID), Telegraphic Transfer (T/T)

Supply Ability
11000 Pieces Per Year

Delivery Time
5 Week

Sample Policy
Contact us for information regarding our sample policy

Packaging Details
Pack Type: Carton Net Weight: 20 pieces or 30 pieces per carton Sealed and labeled with product information and batch number Suitable for safe transportation and storage

Main Export Market(s)
Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa

Certifications
QC80000 Certified SA8000:2014 Certified NSF Food Grade Certification ISO 14001 Certified ISO 45001 Certified IATF 16949 Certified

About EUBO Solvent-Free Two-Component Structural Adhesive for Power Battery Bonding, Chip Bonding, and Automotive Assembly

EUBO Adhesive EP8210 is a solvent-free, two-component structural adhesive specially designed for power battery bonding, chip bonding, and automotive structural assembly. It provides strong adhesion, excellent mechanical performance, and long-term durability under demanding environmental conditions. EP8210 ensures reliable bonding for a variety of substrates, including metals, plastics, and composite materials.

Key Features:

- Solvent-free and environmentally friendly
- Strong structural bonding for dissimilar materials
- Excellent thermal and chemical resistance
- High mechanical strength with long-term durability
- Suitable for automated dispensing and assembly lines

Typical Applications:

- Power battery module bonding and sealing
- Semiconductor chip bonding and packaging
- Automotive structural assembly and reinforcement
- Bonding of electronic components and enclosures
- Structural bonding in new energy equipment