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YW-614E Fast-Curing Epoxy Resin-High Mechanical Strength for PCB Coating & Potting Adhesives
YW-614E Fast-Curing Epoxy Resin-High Mechanical Strength for PCB Coating & Potting Adhesives

YW-614E Fast-Curing Epoxy Resin-High Mechanical Strength for PCB Coating & Potting Adhesives

Price 1 USD ($)/ Gram

MOQ : 2000 Grams

YW-614E Fast-Curing Epoxy Resin-High Mechanical Strength for PCB Coating & Potting Adhesives Specification

  • Form
  • Liquid
  • Features
  • Good Quality
  • Adhesive Type
  • Pressure Sensitive
  • Purity
  • 99%
  • Application
  • Electronic-Grade Epoxy Crosslinker
  • Color
  • Pale Yellow
 

YW-614E Fast-Curing Epoxy Resin-High Mechanical Strength for PCB Coating & Potting Adhesives Trade Information

  • Minimum Order Quantity
  • 2000 Grams
  • Payment Terms
  • Cash in Advance (CID), Telegraphic Transfer (T/T)
  • Supply Ability
  • 10000 Grams Per Year
  • Delivery Time
  • 4 Week
  • Sample Policy
  • Contact us for information regarding our sample policy
  • Packaging Details
  • Pack Type: Cylindrical Can Net Weight: 1 kg per can, 6 kg per carton (6 cans per box) Sealed and labeled with product information and batch number Suitable for safe transportation and storage
  • Main Export Market(s)
  • Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa
  • Certifications
  • QC80000 Certified SA8000:2014 Certified NSF Food Grade Certification ISO 14001 Certified ISO 45001 Certified IATF 16949 Certified
 

About YW-614E Fast-Curing Epoxy Resin-High Mechanical Strength for PCB Coating & Potting Adhesives

YW-614E Provides fast-curing, high-performance protection for electronic components and assemblies. Designed for medium-temperature thermal curing, it delivers excellent mechanical strength, rapid curing, and long-lasting durability, making it ideal for high-mechanical-strength applications in electronics.

Key Features:

  • High reactivity for fast curing

  • Excellent mechanical strength under thermal conditions

  • Suitable for medium-temperature thermal curing with fast curing speed

  • Provides strong adhesion to metals, plastics, and electronic substrates

  • Resistant to aging, cracking, and thermal stress

Typical Applications:

  • Potting adhesives for electronic components

  • PCB encapsulation

  • Chip bonding and assembly

  • High-temperature, high-mechanical-strength applications

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