Send Inquiry
Send InquiryYW-614E Fast-Curing Epoxy Resin-High Mechanical Strength for PCB Coating & Potting Adhesives
Price 1 USD ($)/ Gram
YW-614E Fast-Curing Epoxy Resin-High Mechanical Strength for PCB Coating & Potting Adhesives Specification
- Features
- Good Quality
- Adhesive Type
- Pressure Sensitive
- Form
- Liquid
- Purity
- 99%
- Application
- Electronic-Grade Epoxy Crosslinker
- Color
- Pale Yellow
YW-614E Fast-Curing Epoxy Resin-High Mechanical Strength for PCB Coating & Potting Adhesives Trade Information
- Minimum Order Quantity
- 2000 Grams
- Payment Terms
- Cash in Advance (CID), Telegraphic Transfer (T/T)
- Supply Ability
- 10000 Grams Per Year
- Delivery Time
- 4 Week
- Sample Policy
- Contact us for information regarding our sample policy
- Packaging Details
- Pack Type: Cylindrical Can Net Weight: 1 kg per can, 6 kg per carton (6 cans per box) Sealed and labeled with product information and batch number Suitable for safe transportation and storage
- Main Export Market(s)
- Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa
- Certifications
- QC80000 Certified SA8000:2014 Certified NSF Food Grade Certification ISO 14001 Certified ISO 45001 Certified IATF 16949 Certified
About YW-614E Fast-Curing Epoxy Resin-High Mechanical Strength for PCB Coating & Potting Adhesives
YW-614E Provides fast-curing, high-performance protection for electronic components and assemblies. Designed for medium-temperature thermal curing, it delivers excellent mechanical strength, rapid curing, and long-lasting durability, making it ideal for high-mechanical-strength applications in electronics.
Key Features:
-
High reactivity for fast curing
-
Excellent mechanical strength under thermal conditions
-
Suitable for medium-temperature thermal curing with fast curing speed
-
Provides strong adhesion to metals, plastics, and electronic substrates
-
Resistant to aging, cracking, and thermal stress
Typical Applications:
-
Potting adhesives for electronic components
-
PCB encapsulation
-
Chip bonding and assembly
-
High-temperature, high-mechanical-strength applications
Price:
- 50
- 100
- 200
- 250
- 500
- 1000+
More Products in Electronic Adhesive Category
YW-603E High-Functionality Epoxy Resin-High Crosslink Density & Thermal Stability for IC & Semiconductor Encapsulation
Price 1 USD ($) / Gram
Minimum Order Quantity : 2000 Grams
Shelf Life : 12 Months
Features : High Crosslink Density, Excellent Thermal Stability, Superior Dielectric Properties, Moisture Resistant, Good Moldability
Storage Temperature : 525C Celsius (oC)
Color : Pale Yellow
EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly
Price 16 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Shelf Life : 6 Months
Features : High Quality
Storage Temperature : 25 Celsius (oC)
Color : Offwhite
EUBO Thermal Conductive Adhesive Solvent-Free Two-Component Thermal Conductive Adhesive for EV Battery Pack Bonding
Price 15 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Shelf Life : 6 Months
Features : High Quality
Storage Temperature : 25 Celsius (oC)
Color : Offwhite
Single-Component UV Epoxy Adhesive,Fast-Curing,High-Strength Glue for Metal,Glass,Wood,Plastic and More,UV Curing Epoxy Adhesive
Price 13 USD ($) / Kilograms
Minimum Order Quantity : 100 Kilograms
Shelf Life : 6 Months
Features : High Quality
Storage Temperature : 25 Celsius (oC)
Send InquiryOur Products
Send Inquiry
Developed and Managed by Infocom Network Private Limited.
