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Send InquiryEUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly
Price 16 USD ($)/ Piece
EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly Specification
- Features
- High Quality
- Adhesive Type
- Hot Melt
- Storage Temperature
- 25 Celsius (oC)
- Shelf Life
- 6 Months
- Form
- Liquid
- Application
- smartphone back cover bonding
- Color
- Off-white
- Physical State
- Liquid
EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly Trade Information
- Minimum Order Quantity
- 100 Pieces
- Payment Terms
- Cash in Advance (CID), Telegraphic Transfer (T/T)
- Supply Ability
- 12000 Pieces Per Year
- Delivery Time
- 5 Week
- Sample Policy
- Contact us for information regarding our sample policy
- Packaging Details
- Pack Type: Carton Net Weight: 20 pieces or 30 pieces per carton Sealed and labeled with product information and batch number Suitable for safe transportation and storage
- Main Export Market(s)
- Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa
- Certifications
- QC80000 Certified SA8000:2014 Certified NSF Food Grade Certification ISO 14001 Certified ISO 45001 Certified IATF 16949 Certified
About EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly
EUBO UR9665 is a custom adhesive specifically developed for smartphone back cover bonding. It provides strong adhesion, excellent durability, and reliable performance, making it ideal for structural bonding in consumer electronics. UR9665 is compatible with various materials commonly used in back cover assemblies, ensuring secure attachment and long-term stability even under challenging environmental conditions.
Key Features:
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Strong bonding performance for smartphone back covers
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Excellent resistance to heat, humidity, and impact
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Suitable for structural bonding of plastic, glass, and metal substrates
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Supports automated dispensing and high-throughput production
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Typical Applications:
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Smartphone back cover bonding
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Structural bonding in mobile devices and other consumer electronics
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Price:
- 50
- 100
- 200
- 250
- 500
- 1000+
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