Send Inquiry
Send InquiryEUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly
Price 16 USD ($)/ Piece
EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly Specification
- Shelf Life
- 6 Months
- Adhesive Type
- Hot Melt
- Storage Temperature
- 25 Celsius (oC)
- Features
- High Quality
- Form
- Liquid
- Application
- smartphone back cover bonding
- Color
- Off-white
- Physical State
- Liquid
EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly Trade Information
- Minimum Order Quantity
- 100 Pieces
- Payment Terms
- Cash in Advance (CID), Telegraphic Transfer (T/T)
- Supply Ability
- 12000 Pieces Per Year
- Delivery Time
- 5 Week
- Sample Policy
- Contact us for information regarding our sample policy
- Packaging Details
- Pack Type: Carton Net Weight: 20 pieces or 30 pieces per carton Sealed and labeled with product information and batch number Suitable for safe transportation and storage
- Main Export Market(s)
- Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa
- Certifications
- QC80000 Certified SA8000:2014 Certified NSF Food Grade Certification ISO 14001 Certified ISO 45001 Certified IATF 16949 Certified
About EUBO Custom Adhesive for Smartphone Back Cover Bonding Suitable for Consumer Electronics Assembly
EUBO UR9665 is a custom adhesive specifically developed for smartphone back cover bonding. It provides strong adhesion, excellent durability, and reliable performance, making it ideal for structural bonding in consumer electronics. UR9665 is compatible with various materials commonly used in back cover assemblies, ensuring secure attachment and long-term stability even under challenging environmental conditions.
Key Features:
-
-
-
Strong bonding performance for smartphone back covers
-
Excellent resistance to heat, humidity, and impact
-
Suitable for structural bonding of plastic, glass, and metal substrates
-
Supports automated dispensing and high-throughput production
-
-
Typical Applications:
-
-
Smartphone back cover bonding
-
Structural bonding in mobile devices and other consumer electronics
-
Price:
- 50
- 100
- 200
- 250
- 500
- 1000+
More Products in Electronic Adhesive Category
YW-603E High-Functionality Epoxy Resin-High Crosslink Density & Thermal Stability for IC & Semiconductor Encapsulation
Price 1 USD ($) / Gram
Minimum Order Quantity : 2000 Grams
Application : ElectronicGrade Epoxy Crosslinker
Color : Pale Yellow
Features : High Crosslink Density, Excellent Thermal Stability, Superior Dielectric Properties, Moisture Resistant, Good Moldability
Storage Temperature : 525C Celsius (oC)
EUBO Adhesive for OLED Module Frame Bonding Display Frame Adhesive Bezel-less Screen Edge Bonding Adhesive
Price 15 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Application : Edge Sealing for OLED/Epaper Displays
Color : Light Yellow
Features : High Quality
Storage Temperature : 40 Celsius (oC)
EUBO Thermal Conductive Adhesive Solvent-Free Two-Component Thermal Conductive Adhesive for EV Battery Pack Bonding
Price 15 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Application : automotive power battery packs
Color : Offwhite
Features : High Quality
Storage Temperature : 25 Celsius (oC)
EUBO High-Strength Epoxy for ABS Material Bonding Durable Adhesive for Automotive Interiors and Smart Devices
Price 15 USD ($) / Piece
Minimum Order Quantity : 100 Pieces
Application : bonding ABS and similar engineering plastics
Color : black
Features : High Quality
Storage Temperature : 25 Celsius (oC)
Send InquiryOur Products
Send Inquiry
Developed and Managed by Infocom Network Private Limited.
